MLCC industry leader signals capacity expansion! Executive reveals optimism about AI-driven demand, describing the current assessment as “more ambitious.”
📰 News Source: buff.ly/Cs0SS4H
As AI chip sizes grow and integrate more HBM, 2.5D packages are getting larger, straining TSMC’s CoWoS capacity. Could Intel’s lower-cost EMIB-T shift CSP orders? 💡More analysis from #TrendForce: buff.ly/2z3zKB7 🔗
⚡ EVs Are No Longer Just Green. They're Energy Security.
The US-Iran conflict blockaded Hormuz and spiked global oil prices, exposing the fragility of fossil-fuel transport. NEVs have shifted from carbon-reduction tools to strategic energy-hedging assets. Reduced oil dependency
The Chinese Academy of Sciences reportedly developed GAA transistors using #DUV, potentially paving a path toward 3nm-level performance without relying on EUV lithography.💡More: buff.ly/QomWkx6 🔗
Complement, not competitor. #CXL is emerging as a new tier alongside #HBM in the AI memory stack — and Samsung, SK hynix, Micron and Kioxia are each moving at their own pace.
#CXL may offer comparable performance at significantly lower costs, but #OpenAI and #Intel see it complementing—not replacing—#HBM. That could be welcome news for HBM leaders Samsung and SK hynix.💡More: pse.is/9mkt9q 🔗