TrendForce’s latest research into advanced semiconductor packaging reveals that GPU suppliers and hyperscale CSPs are continuing to develop increasingly powerful and versatile AI chips, making larger package sizes a key development priority for 2.5D packaging. Although TSMC’s CoWoS-L faces competition from Intel’s EMIB-T, its advantages in technology maturity and yield are expected to keep it the mainstream packaging solution for AI chips through 2028.
TrendForce’s latest AI server industry research reports that CSPs are accelerating infrastructure deployments to meet surging demand for AI applications. TrendForce estimates that global data center power demand capacity will reach 161 GW in 2026, up approximately 31% YoY. AI servers will be the primary driver of this growth, accounting for an estimated 33.4% of total demand capacity.
TrendForce’s latest memory industry research indicates that the NOR Flash market is undergoing its most significant structural shift in supply and demand in nearly a decade. AI-related products are absorbing a substantial share of production capacity, leaving suppliers limited room to increase NOR Flash bit output even as demand for high-end applications continues to grow.
According to TrendForce’s latest IC design industry research, expanding AI applications continued to drive demand for GPUs, CPUs, ASICs, and interconnect products. Consequently, combined revenue of the world’s top 10 fabless IC design companies surged 73% YoY to more than US$141.45 billion in 2Q26.
Apple has officially launched its first foldable smartphone, the iPhone Duo. Featuring a book-style inward-folding design, the device comes with a 7.6-inch inner display and a 5.4-inch cover display. TrendForce estimates that iPhone Duo shipments will reach approximately 5 million units in 2026, giving Apple a 24.8% share of the foldable smartphone market and making it the second-largest brand behind Samsung.
